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RISModeling of Two Phase Evaporative Heat Transfer in Three Dimensional Multicavity High Performance Microprocessor Chip Stacks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Threedimensional (3D) stacking of integratedcircuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with areaarray throughsiliconvias (TSVs). This reduces the length ...