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Heat Conduction and Thermo-Elastic Stress Field Disturbed by a Thermal-Medium Crack Propagating in Orthotropic Materials Characterized by Real or Complex Eigenvalues
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A dynamic, partially permeable crack model for orthotropic materials is established with the crack full of thermal medium. Besides external thermal and elastic loadings, the heat flux generated by the crack interior full ...
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