Abstract: Fracture mechanics approaches have been used to study reliability problems in electronic packages, in particular, adhesion related failure in flip chip assembly. It was verified in this work ...

Abstract: Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we ...

Abstract: The thermal fatigue failure of SnPb solder joints of flip chip on board with and without underfill for two types of flip-chip packages was investigated by conducting thermal cycling test, ...