Abstract: Solar silicon wafers are mainly produced through multiwire sawing. The sawing process induces micro cracks on the wafer surface, which are responsible for brittle fracture. Hence, it is important to scrutinize the crack ...

Abstract: Vibration is one of the most common loading modes during handling and transport of solar silicon wafers and has a great influence on the breakage rate. In order to control the breakage rate during handling and facilitate ...

Abstract: Solar wafer/cell breakage depends on the combination of the stresses generated in the handling and the presence of structural defects such as cracks. Suction process is a common loading during silicon wafer handling. This ...