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RISPrediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Conventional reliability tests for the evaluation of pad cratering resistance are mainly classified into two categories: the board level test and the joint level test. The board-level test is to imitate the loading conditions ...
Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Repeated loading is an important reason to cause pad cratering fatigue failure in ball grid array (BGA) device in printed circuit board (PCB) assembly. For industry application, the board level drop test is commonly applied ...
Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, a smart heat pump, which could be used for the cooling of electronics, made of laminated structure of thermoelectric (TE) and electrocaloric (EC) materials, is studied. A simple arrangement of two TE layers ...
Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In recent years, due to the increased size of ball grid array (BGA) devices, the assembly of BGAs on printed circuit boards through surface mount technology has encountered unprecedented challenges from thermal warpage. ...