Abstract: Due to the complex structure and thermal mismatch of coaxial through silicon via (TSV), cracks easily occur under thermal load, leading to interface delamination or spalling failure. The reliability issue of coaxial TSV ...

Abstract: Metasurfaces are advantageous in wavefront manipulation owing to their compact and flat nature. Particularly, ultrathin and completely smooth metasurfaces with giant phase delay and perfect impedance match are critically ...