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Spatial Packaging and Routing Optimization of Complex Interacting Engineered Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Designing the 3D layout of interconnected systems (SPI2), which is a ubiquitous task in engineered systems, is of crucial importance. Intuitively, it can be thought of as the simultaneous placement of (typically rigid) ...
Toward Holistic Design of Spatial Packaging of Interconnected Systems With Physical Interactions (SPI2)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional spatial packaging of interconnected systems with physical interactions (SPI2) design plays a vital role in the functionality, operation, energy usage, and life cycle of practically all engineered systems, ...
Multi-Physics Three-Dimensional Component Placement and Routing Optimization Using Geometric Projection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This article presents a novel three-dimensional topology optimization framework developed for 3D spatial packaging of interconnected systems using a geometric projection method (GPM). The proposed gradient-based topology ...
Enumeration and Identification of Unique 3D Spatial Topologies of Interconnected Engineering Systems Using Spatial Graphs
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Systematic enumeration and identification of unique 3D spatial topologies (STs) of complex engineering systems (such as automotive cooling systems, electric power trains, satellites, and aero-engines) are essential to ...