Abstract: A kinematic calibration model for serial robotic manipulators is presented. This model is based on the zero position analysis method, and is not prone to the difficulties encountered in case ...

Abstract: This paper addresses the question of how to assess the errors made when the exact three-dimensional linear elasticity solution for the axisymmetric dynamic deformation of an elastic plate is ...

Abstract: In this paper, a nonlinear finite element framework was established for processing mechanics modeling of flip-chip packaging assemblies and relevant layered manufacturing. In particular, topological ...

Abstract: A unified constitutive model for polymer films is proposed with viscoelastic characterization at small deformation and viscoplastic characterization at large deformation based on molecular chain ...

Abstract: A damage coupling framework is proposed with a unified viscoplastic constitutive model for the fatigue life prediction of solder alloys, including a consistent and systematic procedure for the ...

Abstract: In this paper, the creep behavior of a flip-chip package under a thermal load was investigated by using nonlinear finite element technique coupled with high density laser moiré interferometry. ...

Abstract: The thermomechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep, and fatigue, are carried out on a ...

Abstract: Complete streets facilitate multimodal travel by improving both transportation access and safety by emphasizing the user, not the automobile. This case study evaluates the impacts of a complete street retrofit on a mixed ...