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    Failure Analysis of Full Delamination on the Stacked Die Leaded Packages 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003:;page 392
    Author(s): T. Y. Lin; Y. Y. Ma; Z. P. Xiong; Y. F. Yao; Lane Tok; Z. Y. Yu; Budi Njoman; K. H. Chua
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: There has been significant demand for stacked die technology during the past few years. The stacked die devices are mainly used in portable consumer products. This kind of silicon integration ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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