YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-3 of 3

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Erratum: “Parametric Studies on the Three-Layer Microcirculatory Model for Surface Tissue Energy Exchange” (Journal of Biomechanical Engineering, 1986, 108, pp. 89–96) 

    Source: Journal of Biomechanical Engineering:;1986:;volume( 108 ):;issue: 002:;page 110
    Author(s): Z. Dagan; S. Weinbaum; L. M. Jiji
    Publisher: The American Society of Mechanical Engineers (ASME)
    Request PDF

    Parametric Studies on the Three-Layer Microcirculatory Model for Surface Tissue Energy Exchange 

    Source: Journal of Biomechanical Engineering:;1986:;volume( 108 ):;issue: 001:;page 89
    Author(s): Z. Dagan; S. Weinbaum; L. M. Jiji
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The new three-layer microvascular mathematical model for surface tissue heat transfer developed in [1, 2], which is based on detailed vascular casts and tissue temperature measurements in the ...
    Request PDF

    Prediction of Surface Temperature and Heat Flux of a Microelectronic Chip With Jet Impingement Cooling 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001:;page 57
    Author(s): X. S. Wang; Z. Dagan; L. M. Jiji
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, a previously developed analytic solution is applied to the conjugate heat transfer problem of jet impingement cooling of a microelectronic chip. The analysis is used to predict ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian