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    Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 001:;page 11006
    Author(s): Yung-Shin Tseng; Tzu-Chen Hung; Bau-Shei Pei
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found ...
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    Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 001:;page 11004
    Author(s): Yen-Shu Chen; Kuo-Hsiang Chien; Yung-Shin Tseng; Yea-Kuang Chan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study presents an approximation for determining an optimized thickness of a concentric heated rectangular plate and derives an analytical solution for spreading resistance of a spreader ...
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