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    Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink Array 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004:;page 518
    Author(s): Gaowei Xu; Yingjun Cheng; Le Luo
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The heat-transfer characteristics of 128 small-sized plate-fin heat sinks in a supercomputer chassis are investigated with CFD simulation. The V-shaped curves of the chip temperature versus fin ...
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