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    A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions 

    Source: Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 004:;page 41008
    Author(s): Tao, Bo; Wu, Guanghua; Yin, Zhouping; Xiong, Youlun
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Hygrothermal environments can degrade anisotropic conductive adhesive (ACA) joints by weakening the shear strength of adhesive interface. In this paper, the shear strength degradation model of ACA joints under hygrothermal ...
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    Competing Fracture of Thin Chip Transferring From/Onto Prestrained Compliant Substrate 

    Source: Journal of Applied Mechanics:;2015:;volume( 082 ):;issue: 010:;page 101012
    Author(s): Liu, Huimin; Liu, Zunxu; Xu, Zhoulong; Yin, Zhouping; Huang, YongAn; Chen, Jiankui
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The transferring of thin chip from donor to receptor plays a critical role in advanced electronic package, and the productivity is determined by the interfacial behavior between chip and substrate during chip transferring. ...
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    Safe Trajectory Generation for Wheel-Leg Hybrid Mechanism Using Discrete Mechanics and Optimal Control 

    Source: Journal of Mechanisms and Robotics:;2023:;volume( 016 ):;issue: 006:;page 61014-1
    Author(s): Li, Yiqun; Gao, Jiahui; Chen, Kai; Chen, Wei; Yin, Zhouping
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The wheel-legged robot inherits the merit of both the wheeled robot and the legged robot, which can not only adapt to the complex terrain but also maintain the driving efficiency on the flat road. This article presents an ...
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