Abstract: Low cycle fatigue of solder joints is one of the major kinds of failures in second level interconnections of an electronic package. The fatigue failure is caused by thermal strains which are ...

Abstract: Process-induced residual stresses can play a significant role in the reliability of electronic components and packages. In this paper, a practical method is developed to determine residual stresses ...

Abstract: The main purpose of this study was to determine a suitable strain energy function for a specific elastomer. A survey of various strain energy functions proposed in the past was made. For ...