Search
CSV
RISThe Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: To investigate the effect of stencil thickness and reflow ambient atmosphere on the reliability of ceramic ball grid array (CBGA) assemblies, three levels of stencil thickness, 0.10, 0.15, and ...