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    A Linear Markov Model for East Asian Monsoon Seasonal Forecast 

    Source: Journal of Climate:;2013:;volume( 026 ):;issue: 014:;page 5183
    Author(s): Wu, Qiaoyan; Yan, Ying; Chen, Dake
    Publisher: American Meteorological Society
    Abstract: linear Markov model has been developed to predict the short-term climate variability of the East Asian monsoon system, with emphasis on precipitation variability. Precipitation, sea level pressure, zonal and meridional ...
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    A Global Correction Process for Flat Optics With Patterned Polishing Pad 

    Source: Journal of Manufacturing Science and Engineering:;2019:;volume( 141 ):;issue: 009:;page 91012
    Author(s): Li, Weisi; Zhou, Ping; Geng, Zhichao; Yan, Ying; Guo, Dongming
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: To improve the efficiency of flat optics fabrication, a global correction method with the patterned polishing pad is developed in this paper. Through creating grooves on a polishing pad, the contact pressure distribution ...
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    Prediction of Surface Profile Evolution of Workpiece and Lapping Plate in Lapping Process 

    Source: Journal of Manufacturing Science and Engineering:;2022:;volume( 144 ):;issue: 008:;page 81001-1
    Author(s): Geng, Zhichao; Zhou, Ping; Meng, Lei; Yan, Ying; Guo, Dongming
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Lapping has a history of hundreds of years, yet it still relies on the experience of workers. To improve the automaticity and controllability of the lapping process, a modeling method of friction and wear is developed to ...
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    Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer 

    Source: Journal of Manufacturing Science and Engineering:;2018:;volume( 140 ):;issue: 012:;page 121001
    Author(s): Lin, Bin; Zhou, Ping; Wang, Ziguang; Yan, Ying; Kang, Renke; Guo, Dongming
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle ...
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    Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding 

    Source: Journal of Manufacturing Science and Engineering:;2017:;volume( 139 ):;issue: 008:;page 81012
    Author(s): Zhou, Ping; Yan, Ying; Huang, Ning; Wang, Ziguang; Kang, Renke; Guo, Dongming
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Subsurface damage (SSD) and grinding damage-induced stress (GDIS) are a focus of attention in the study of grinding mechanisms. Our previous study proposed a load identification method and analyzed the GDIS in a silicon ...
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