Search
Now showing items 1-6 of 6
Practical Investigation into Two Types of Analyses in Predicting Ground Displacements Due to Dewatering and Excavation
Publisher: American Society of Civil Engineers
Abstract: To reduce ground displacements induced by dewatering and excavation in foundation engineering, it is crucial to predict the ground displacements before construction. Two types of analyses, i.e., transient analysis (TA) and ...
Simultaneous Nitrogen and Phosphorus Removal Using a Double Sludge Switching Sequencing Batch Reactor
Publisher: American Society of Civil Engineers
Abstract: A new process using a sequencing batch reactor (SBR) and two smaller sludge hoppers is proposed for the simultaneous removal of phosphorus and nitrogen from wastewater. In the double sludge switching sequencing batch ...
Stratified Settlement Characteristics of the Soil Strata in Shanghai due to Dewatering
Publisher: American Society of Civil Engineers
Abstract: Dewatering-induced ground settlement is an important issue, and there a cumulative effect in stratified soil settlement. Detailed research of the stratified soil settlement devotes to a better evaluation of ground settlement. ...
A Surface Skewness and Kurtosis Integrated Stress Concentration Factor Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Surface skewness and kurtosis are two crucial topography property indexes that greatly influence the functional performance of the machined surface. This paper proposes a modified model of stress concentration factor (SCF), ...
Hydration, Hardening Properties, and Microstructure of Magnesium Phosphate Cement–Emulsified Asphalt Composites across Various Stoichiometries
Publisher: American Society of Civil Engineers
Abstract: To promote green and low-carbon development in the rehabilitation of damaged asphalt pavements, a cold patching material combining magnesium phosphate cement (MPC) with emulsified asphalt (EA) was developed. This study ...
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For the first time, finite element analysis (FEA) is applied to the thermal-compression flip-chip process in micro-electronics. By adding the bump height nonuniformity and the morphology variance, a common basal line is ...
CSV
RIS