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    Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21116-1
    Author(s): Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In extreme environmental applications, such as aerospace and automotive, electronics may endure high or low operating temperatures during service, handling, and storage. An electronic assembly may experience strain rates ...
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    Image-Based Flashback Detection in a Hydrogen-Fired Gas Turbine Using a Convolutional Autoencoder 

    Source: Journal of Engineering for Gas Turbines and Power:;2025:;volume( 147 ):;issue: 008:;page 81015-1
    Author(s): Porath, Paul; Yadav, Vikas; Panek, Lukasz; Ghani, Abdulla
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Flame flashback (FB) is a major concern in hydrogen-fired gas turbines. In order to determine the flashback propensity of a hydrogen burner, several burner design tests at different operating points and fuel blends are ...
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    Evaluation of Data-Driven Classifiers for an Ignition Forecast of Large Gas Turbines 

    Source: Journal of Engineering for Gas Turbines and Power:;2024:;volume( 147 ):;issue: 002:;page 21007-1
    Author(s): Lang, Florian; Savtschenko, Maximilian; Yadav, Vikas; Ghani, Abdulla
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Prediction of successful ignition is a challenging task that requires knowledge of the local thermochemical state in highly turbulent flow conditions. For typical industrial gas turbine (GTs) conditions operated on active ...
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    Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys 

    Source: Journal of Electronic Packaging:;2020:;volume( 143 ):;issue: 002:;page 021005-1
    Author(s): Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Electronic components in downhole oil drilling and gas industry applications, automotive, and avionics may be exposed to high temperatures (>150 °C) and high strain rates (1–100 per sec) during storage, operation, and ...
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    Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method 

    Source: Journal of Electronic Packaging:;2023:;volume( 146 ):;issue: 002:;page 21004-1
    Author(s): Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Electronics will experience high and low working temperatures during operations, handling, and storage in severe environments applications such as download drilling, aircraft, and transportation. Temperatures in the vehicle ...
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    Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041113-1
    Author(s): Lall, Pradeep; Thomas, Tony; Yadav, Vikas; Narangaparambil, Jinesh; Liu, Wei
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The use of flexible electronics wearable applications has prompted the need to understand the stresses imposed during human motion for a range of activities. Wearable applications may involve situations in which the ...
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    Hybrid Surrogate Modeling Approach for Data Reduction and Design Space Exploration of Turbine Blades 

    Source: Journal of Engineering for Gas Turbines and Power:;2024:;volume( 147 ):;issue: 007:;page 71004-1
    Author(s): Ali, Sazeed S.; Yadav, Vikas S.; Nouri, Behnam; Ghani, Abdulla
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The conventional iterative optimization of turbine blades using computer-aided engineering simulations is resource-intensive, with high costs and time demands, as well as significant challenges in computational requirements ...
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