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    Combined Moisture and Thermal Stresses Failure Mode in a PLCC 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 004:;page 249
    Author(s): Y. Kornblum; J. C. Glaser
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A finite element analysis has been conducted to provide a new explanation for PLCC cracking during soldering and develop a working model for the cracking phenomena. The model shows that cracking ...
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