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    The Burdened Area as a Structural Indicator of Interface Bonding Strength 

    Source: Journal of Engineering Materials and Technology:;1998:;volume( 120 ):;issue: 002:;page 137
    Author(s): Y. F. Luo
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In laminate structures, the interface debonding failures usually result from very complex fracture mechanisms which lead to different strengthening approaches. The bonding strength of two dissimilar ...
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    Metal Removal in EDM Driven by Shifting Secondary Discharge 

    Source: Journal of Manufacturing Science and Engineering:;2009:;volume( 131 ):;issue: 003:;page 31014
    Author(s): Y. F. Luo; Jia Tao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Metal removal mechanism in electrical discharge machining (EDM) is revealed as shifting secondary discharges inside a cathodic root. Typical for EDM sinking process, the electrode couple of steel ...
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    A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 003:;page 201
    Author(s): Y. F. Luo; K. P. Rajurkar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The bonding strength of deposited metallic thin films or strips on a hard substrate is investigated through micro-strength tests and micro-mechanics analyses. The combination of Ti:W-Au/Cu deposited ...
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