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    Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages 

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003:;page 240
    Author(s): Y. Kondo; H. Matsushima; T. Komatsu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Optimization of pin-fin heat sinks for impingement cooling of electronic components was studied. The study was based on a semi-empirical zonal model for determining thermal resistance as well ...
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    Cooling-Air Injection Into Secondary Flow and Loss Fields Within a Linear Turbine Cascade 

    Source: Journal of Turbomachinery:;1991:;volume( 113 ):;issue: 003:;page 375
    Author(s): A. Yamamoto; Y. Kondo; R. Murao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In order to understand overall performance and internal flows of air-cooled turbine blade rows, flows in a model linear cascade were surveyed with secondary air injection from various locations ...
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    Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003:;page 259
    Author(s): Y. Kondo; M. Behnia; W. Nakayama; H. Matsushima
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The study of optimization of finned heat sinks for impingement cooling of electronic components was undertaken. The procedure was based on a semiempirical zonal approach to the determination of ...
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