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RISAnalytical Solutions and a Numerical Approach for Diffusion Induced Stresses in Intermetallic Compound Layers of Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Intermetallic compounds (IMC) play a key role in the mechanical reliability of solder joints. The present work investigates the diffusioninduced stress developed in the Cu pad/IMC/solder sandwich structure during a solidstate ...
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties, ...