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    Prediction of Surface Temperature and Heat Flux of a Microelectronic Chip With Jet Impingement Cooling 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001:;page 57
    Author(s): X. S. Wang; Z. Dagan; L. M. Jiji
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, a previously developed analytic solution is applied to the conjugate heat transfer problem of jet impingement cooling of a microelectronic chip. The analysis is used to predict ...
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