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    Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001:;page 63
    Author(s): X. J. Wei; Y. K. Joshi; P. M. Ligrani
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50×10−6m(50μm) deep and 200×10−6m(200μm) ...
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