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RISMechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Interface degradation between dissimilar materials in the flip chip packages with anisotropic conductive adhesive joint is susceptible to mechanical and electrical failure upon temperature cycling. ...
Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling ...