Abstract: As the heat generation at device footprint continuously increases in modern high-tech electronics, there is an urgent need to develop new cooling devices that balance the increasing power demands. To meet this need, ...

Abstract: As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. In this regard, two-phase cooling methods which capitalize on thin-film ...

Abstract: Gallium nitride (GaN) highelectronmobility transistors (HEMTs) dissipate high power densities which generate hotspots and cause thermomechanical problems. Here, we propose and simulate GaNbased HEMT technologies that can ...

Abstract: Enhanced boiling is one of the popular cooling schemes in thermal management due to its superior heat transfer characteristics. This study demonstrates the ability of copper inverse opal (CIO) porous structures to enhance ...