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Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This technical note presents an introduction to boundary-condition-independent reduced-order modeling of complex electronic components using the proper orthogonal decomposition (POD)-Galerkin approach. ...
Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done ...
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