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RISFinite Element Analysis on Soft-Pad Grinding of Wire-Sawn Silicon Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicon is the primary semiconductor material used to fabricate microchips. The quality of microchips depends directly on the quality of starting silicon wafers. A series of processes are required ...
Investigating Strength and Deformation Characteristics of Heavy-Haul Railway Embankment Materials Using Large-Scale Undrained Cyclic Triaxial Tests
Publisher: American Society of Civil Engineers
Abstract: Heavy-haul railway embankments in China are generally constructed with coarse-grained granular (CGS) materials. The accumulation of permanent deformations in CGS materials remains a significant concern and technical challenge ...