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RISA Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heat spreading from local, time-dependent heat sources in electronic packages results in the propagation of temperature nonuniformities through the stack of material layers attached to the chip. Available models either ...
Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink Base
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For thermal management architectures wherein the heat sink is embedded close to a dynamic heat source, nonuniformities may propagate through the heat sink base to the coolant. Available transient models predict the effective ...
Special Section on IMECE 2016
Publisher: The American Society of Mechanical Engineers (ASME)
The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As the size, weight, and performance requirements of electronic devices grow increasingly demanding, their packaging has become more compact. As a result of thinning or removing the intermediate heat spreading layers, ...
Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Pluggable optoelectronic transceiver modules are widely used in the fiber-optic communication infrastructure. It is essential to mitigate thermal contact resistance between the high-power optical module and its riding heat ...
Data Generation and Training of Surrogate Models for Friction Factor and Nusselt Number in Low Reynolds Number Flows Through Pin Fin Geometries
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The design of various biomedical, electronics cooling, and microfluidic devices relies on geometry-specific models and empirical correlations for flow and heat transfer through microscale pin fin geometries. Machine learning ...
Hierarchical Superhydrophobic Copper for Sustained Dropwise Condensation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Engineering surfaces that sustain continuous dropwise condensation, and are composed of materials commonly employed in heat transfer applications, are of great interest for scaledup industrial systems. We fabricate ...
Advances in Fluid and Thermal Transport Property Analysis and Design of Sintered Porous Wick Microstructures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Sintered porous structures are ubiquitous as heat transport media for thermal management and other applications. In particular, lowporosity sintered packed beds are used as capillarywicking and evaporationenhancement ...
Quantitative Evaluation of the Dependence of Pool Boiling Heat Transfer Enhancement on Sintered Particle Coating Characteristics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Immersion cooling strategies often employ surface enhancements to improve the pool boiling heat transfer performance. Sintered particle/powder coatings have been commonly used on smooth surfaces to reduce the wall superheat ...
Numerical Simulation of Evaporating Two-Phase Flow in a High-Aspect-Ratio Microchannel with Bends
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Despite the demand for high-performance, two-phase cooling systems, high-fidelity simulations of flow boiling in complex microchannel geometries remains a challenging numerical problem. We conduct a first-principles-based ...