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RISCharacterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, we present the design of a passive test chip with thermal test structures in the Metal 1 layer of the back-end of line (BEOL) for the experimental thermal characterization of the intertier thermal resistance ...