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A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power dissipation in electronic devices is projected to increase over the next 10years to the range of 150–250W per chip for high performance applications. One of the primary obstacles to the ...
In Situ Imaging of High Cycle Fatigue Crack Growth in Single Crystal Nickel-Base Superalloys by Synchrotron X-Radiation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel X-ray synchrotron radiation approach is described for real-time imaging of the initiation and growth of fatigue cracks during ultrasonic fatigue (f=20kHz). We report here on new insights ...