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RISSingle- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the growth and acceptance of liquid immersion cooling as a viable thermal management technique for high performance microelectronics, fundamental questions regarding the nature of the flow within the system will need ...
Durability of Low Melt Alloys as Thermal Interface Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study investigates the reliability of low melt alloys (LMAs) containing gallium (Ga), indium (In), bismuth (Bi), and tin (Sn) for the application as Thermal interface materials (TIMs). The analysis described herein ...