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    Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module 

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 004:;page 41007
    Author(s): Gess, Joshua; Bhavnani, Sushil; Wayne Johnson, R.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: With the growth and acceptance of liquid immersion cooling as a viable thermal management technique for high performance microelectronics, fundamental questions regarding the nature of the flow within the system will need ...
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    Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004:;page 373
    Author(s): Pradeep Lall; Dhananjay Panchagade; Yueli Liu; Wayne Johnson; Jeff Suhling
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Portable electronics is subjected to extreme accelerations in shock and drop impact. Product development cycle times and the cost constraints often restrict the number of design variations tested ...
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    Navier-Stokes and Comprehensive Analysis Performance Predictions of the NREL Phase VI Experiment 

    Source: Journal of Solar Energy Engineering:;2003:;volume( 125 ):;issue: 004:;page 457
    Author(s): Earl P. N. Duque; Michael D. Burklund; Wayne Johnson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A lifting-line code, CAMRAD II, and a Reynolds-Averaged Navier-Stokes code, OVERFLOW-D, were used to predict the aerodynamic performance of a two-bladed horizontal axis wind turbine. All computations ...
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    Durability of Low Melt Alloys as Thermal Interface Materials 

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001:;page 10913
    Author(s): Roy, Chandan K.; Bhavnani, Sushil; Hamilton, Michael C.; Wayne Johnson, R.; Knight, Roy W.; Harris, Daniel K.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study investigates the reliability of low melt alloys (LMAs) containing gallium (Ga), indium (In), bismuth (Bi), and tin (Sn) for the application as Thermal interface materials (TIMs). The analysis described herein ...
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