Abstract: An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the ...

Abstract: This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a ...

Abstract: Increasing miniaturization of microcircuits on chips of increasing size and new schemes of electrical connection, such as flip-chip bonding and surface mounting, are setting more demanding criteria ...

Abstract: This paper reviews the existing knowledge base about thermal contact resistance in cooling electronic equipment, and also highlights some novel issues that are emerging with the advent of compact ...

Abstract: An experimental study of forced convection in impinging flow, using fluorocarbon FX3250 and a simulated electronic chip, was performed. A test section consisting of a 35 mm long, 1 mm wide ...

Abstract: Computational Fluid Dynamics (CFD) codes have proved their high potential as a tool of thermal design of electronic equipment. However, as the product development cycle is shortened, the CFD-based ...

Abstract: Cooling of an array of parallel foil strips stretched on the wall of a narrow rectangular channel to the flow of fluorinert FX3250 is studied experimentally. The coolant is injected in planar ...

Abstract: The seismic safety of city gas supply has been the major research topic of the writers in past decades. To avoid earthquake hazards due to leakage of gas from breakage of buried pipes, a real-time safety control system,