Abstract: This Special Section of the ASME Journal of Electronic Packaging (JEP) is dedicated to state-of-the-art advancements made in nanoscale and microscale thermal energy transport across a variety of electronics cooling platforms. ...

Abstract: Thermal interface materials (TIMs) constitute a critical component for heat dissipation in electronic packaging systems. However, the extent to which a conventional steady-state thermal characterization apparatus can resolve ...

Abstract: This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at ...