YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-2 of 2

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer 

    Source: Journal of Manufacturing Science and Engineering:;2018:;volume( 140 ):;issue: 012:;page 121001
    Author(s): Lin, Bin; Zhou, Ping; Wang, Ziguang; Yan, Ying; Kang, Renke; Guo, Dongming
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle ...
    Request PDF

    Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding 

    Source: Journal of Manufacturing Science and Engineering:;2017:;volume( 139 ):;issue: 008:;page 81012
    Author(s): Zhou, Ping; Yan, Ying; Huang, Ning; Wang, Ziguang; Kang, Renke; Guo, Dongming
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Subsurface damage (SSD) and grinding damage-induced stress (GDIS) are a focus of attention in the study of grinding mechanisms. Our previous study proposed a load identification method and analyzed the GDIS in a silicon ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian