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RISAnalytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle ...
Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Subsurface damage (SSD) and grinding damage-induced stress (GDIS) are a focus of attention in the study of grinding mechanisms. Our previous study proposed a load identification method and analyzed the GDIS in a silicon ...