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RISSimultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A relatively low-cost and easy-to-use strain gauge measurement is proposed here as an alternative method for simultaneously determining the thermally induced warpages and the coefficients of thermal expansion (CTEs) of the ...