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RISHybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We have investigated a novel hybrid nanocomposite thermal interface material (TIM) that consists of silver nanoparticles (AgNPs), silver nanoflakes (AgNFs), and copper microparticles (CuMPs). Continuous metallic network ...