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    A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys 

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 003:;page 162
    Author(s): Z. Qian; W. Ren; S. Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A damage coupling framework is proposed with a unified viscoplastic constitutive model for the fatigue life prediction of solder alloys, including a consistent and systematic procedure for the ...
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    Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens 

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 004:;page 271
    Author(s): W. Ren; D. Shangguan; Z. Qian; M. Lu; S. Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The thermomechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep, and fatigue, are carried out on a ...
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