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    Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips 

    Source: Journal of Heat Transfer:;2010:;volume( 132 ):;issue: 008:;page 81402
    Author(s): W. Escher; T. Brunschwiler; D. Poulikakos; B. Michel
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We report an experimental investigation of a novel, high performance ultrathin manifold microchannel heat sink. The heat sink consists of impinging liquid slot-jets on a structured surface fed ...
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    On the Cooling of Electronics With Nanofluids 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 005:;page 51401
    Author(s): W. Escher; T. Brunschwiler; N. Shalkevich; A. Shalkevich; T. Burgi; B. Michel; D. Poulikakos
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Nanofluids have been proposed to improve the performance of microchannel heat sinks. In this paper, we present a systematic characterization of aqueous silica nanoparticle suspensions with ...
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