Search
Now showing items 1-2 of 2
Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We report an experimental investigation of a novel, high performance ultrathin manifold microchannel heat sink. The heat sink consists of impinging liquid slot-jets on a structured surface fed ...
On the Cooling of Electronics With Nanofluids
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Nanofluids have been proposed to improve the performance of microchannel heat sinks. In this paper, we present a systematic characterization of aqueous silica nanoparticle suspensions with ...
CSV
RIS