Abstract: The present study focuses on the development of reliable response surface models (RSM’s) for the major packaging processes of a typical electronic package. The major objective is to optimize ...

Abstract: The increased use of mobile appliances such as mobile phones and navigation systems in today’s society has resulted in an increase in reliability issues related to drop performance. Mobile ...

Abstract: This paper investigates the effect of the anisotropic behavior of the die and the time- and temperature-dependent behavior of epoxy molding compound on the packaging induced stresses for a quad ...