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RISOn the Study of Piezoresistive Stress Sensors for Microelectronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Stress measurements in microelectronic packaging through piezoresistive sensors take the advantage of both in-situ and nondestructive. In this study, test chips with both p-type and n-type ...
In-Plane Packaging Stress Measurements Through Piezoresistive Sensors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In our previous works, the piezoresistive sensors have been demonstrated to be accurate and efficient tools for stress measurements in microelectronic packaging. In this study, we first designed ...