Abstract: Threedimensional (3D) structure with through silicon via (TSV) technology is emerging as a key issue in microelectronic packaging industry, and electrical reliability has become one of the main technical subjects for the ...

Abstract: AbstractA lightweight and low-cost unmanned aerial vehicle (UAV) system for coastal wave and tide measurements is developed. This system is based on an assembly of a multirotor UAV, a robotic lidar, an altitude and heading ...