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Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study develops a novel glass cover chip (GCC) technique for the packaging of CMOS image sensors (CIS), in which the glass cover plate is attached directly to the chip using a nonconductive ...
Bus Travel-Time Prediction with a Forgetting Factor
Publisher: American Society of Civil Engineers
Abstract: Bus travel-time prediction has drawn a lot of research interests in previous literature. This paper proposes a prediction model for bus travel time based on the support vector machine (SVM) regression method. A forgetting ...
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