Abstract: Enhancements to thermal performance of FC-PBGA packages due to underfill thermal conductivity, controlled collapse chip connection (C4) pitch, package to printed wiring board (PWB) interconnection ...

Abstract: The beneficial effect of using dielectric liquid mixture in reducing temperature overshoot in pool boiling has been studied by the authors (Normington et al., 1992). The current experimental ...

Abstract: This paper summarizes thermal modeling work performed on the Motorola Carbon Monoxide (CO) chemical sensor. Gas sensors need low cost reliable packages, good thermal operation, and low power ...