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RISParametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A high power electronic chip was simulated experimentally to investigate upper cooling capabilities using a variety of pool boiling enhancement techniques. Parametric effects of system pressure, ...
Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A high flux electronic chip was numerically and experimentally simulated to investigate pool boiling capabilities of enhanced metallic surface attachments built upon a 12.7 × 12.7 mm2 base ...