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    A Complete Acoustic Microscopical Analysis of Multilayered Specimens 

    Source: Journal of Applied Mechanics:;1992:;volume( 059 ):;issue: 001:;page 54
    Author(s): T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A theoretical analysis is carried out to synthesize the V(z) curves of multilayered solids immersed in water. Solid layers attenuate ultrasound and change its phase. A liquid layer may be ...
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    Transient Response of an Interface-Crack in a Layered Plate 

    Source: Journal of Applied Mechanics:;1986:;volume( 053 ):;issue: 003:;page 579
    Author(s): T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, the transient response of an interface crack, in a two layered plate subjected to an antiplane stress field, is analytically computed. The problem is formulated in terms of ...
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    Yield Function for Solder Elastoviscoplastic Modeling 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002:;page 147
    Author(s): M. Dube; T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Field reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) ...
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    Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156) 

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 004:;page 45502
    Author(s): M. Dube; T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We respond to the technical content of the discussion as follows:
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    Axisymmetric Scattering of a Plane Longitudinal Wave by a Circular Crack in a Transversely Isotropic Solid 

    Source: Journal of Applied Mechanics:;1991:;volume( 058 ):;issue: 003:;page 695
    Author(s): T. Kundu; A. Boström
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The scattering of elastic waves by a circular crack situated in a transversely isotropic solid is studied here. The axis of material symmetry and the axis of the crack coincides. The incident ...
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    Diffraction of Elastic Waves by a Surface Crack on a Plate 

    Source: Journal of Applied Mechanics:;1981:;volume( 048 ):;issue: 003:;page 570
    Author(s): T. Kundu; A. K. Mal
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The interaction of time harmonic elastic waves with an edge crack in a plate is studied. The crack is assumed to be normal to the plate surface and its depth small compared to plate ...
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    Dynamic Response of an Orthotropic Half-Space With a Subsurface Crack: In-Plane Case 

    Source: Journal of Applied Mechanics:;1991:;volume( 058 ):;issue: 004:;page 988
    Author(s): M. R. Karim; T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Scattering of elastic waves by a subsurface crack in an orthotropic half-space subjected to a surface line load of arbitrary angle of inclination is studied. Green’s functions are developed and ...
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    V(z) Curve Synthesis Using Two Ultrasonic Transducers 

    Source: Journal of Applied Mechanics:;1995:;volume( 062 ):;issue: 002:;page 517
    Author(s): M. A. Awal; T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Traditionally V(z) curves are generated by acoustic microscopes. However, because of the high costs of the commercially available acoustic microscopes, their use is rather limited. In this paper ...
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    Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 001:;page 41
    Author(s): C. Basaran; C. S. Desai; T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Accurate prediction of the thermomechanical cyclic behavior of joints and interfaces in semiconductor devices is essential for their reliable design. In order to understand and predict the behavior ...
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    Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 001:;page 48
    Author(s): C. Basaran; C. S. Desai; T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The finite element procedure with the unified disturbed state modeling concept presented in Part I, Basaran et al. (1998), is verified here with respect to laboratory test results for Pb40/Sn60 ...
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