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    Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages 

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003:;page 240
    Author(s): Y. Kondo; H. Matsushima; T. Komatsu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Optimization of pin-fin heat sinks for impingement cooling of electronic components was studied. The study was based on a semi-empirical zonal model for determining thermal resistance as well ...
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    Refined Numerical Scheme for Advective Transport in Diffusion Simulation 

    Source: Journal of Hydraulic Engineering:;1997:;Volume ( 123 ):;issue: 001
    Author(s): T. Komatsu; K. Ohgushi; K. Asai
    Publisher: American Society of Civil Engineers
    Abstract: We propose an accurate numerical scheme for calculating advection in the simulations of mass, heat, and momentum transport. The second-order spatial derivatives of the advection-diffusion equation can be discretized more ...
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    Discussions and Closure: Refined Numerical Scheme for Advective Transport in Diffusion Simulation 

    Source: Journal of Hydraulic Engineering:;1998:;Volume ( 124 ):;issue: 007
    Author(s): J. Russell Manson; Steve G. Wallis; C. Zoppou; S. Roberts; T. Komatsu; K. Ohgushi; K. Asai
    Publisher: American Society of Civil Engineers
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