Abstract: This paper presents potential application of stainless steel (SS) as a base substrate material for large area multi-chip module-deposited (MCM-D) packaging. Preliminary results on via formation ...

Abstract: Potential application of stainless steel (SS) as a base substrate material for a large area MCM-D packaging is reported in this paper. A test vehicle was fabricated using 0.008 in. thick and ...

Abstract: Polymer/ceramic composite emerges as a novel material system for application as integral capacitors for the next generation of microelectronic industry where the discrete passive components such ...