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    Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density 

    Source: Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 002:;page 21006-1
    Author(s): Zhang, Haibin; Sun, Quan; Sun, Zhidan; Lu, Yebo
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The electromigration (EM) damage is becoming a severe problem in the printed flexible electronics as the printed circuits are fabricated thinner and thinner due to the development of printing technology. In this work, the ...
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    Prediction of Edge Crack in Cold Rolling of Silicon Steel Strip Based on an Extended Gurson–Tvergaard–Needleman Damage Model 

    Source: Journal of Manufacturing Science and Engineering:;2015:;volume( 137 ):;issue: 002:;page 21003
    Author(s): Sun, Quan; Chen, Jianjun; Pan, Hongliang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Edge cracking is commonly observed in cold rolling process. However, its failure mechanism is far from fully understanding due to the complex stresses and plastic flow conditions of steel strip under the rolling condition. ...
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    Risk Analysis of Engineering Change for Distributed Product Design 

    Source: Journal of Computing and Information Science in Engineering:;2021:;volume( 021 ):;issue: 004:;page 041003-1
    Author(s): Yin, Leilei; Sun, Quan; Xu, Youxiong; Shao, Li; Tang, Dunbing
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Nowadays, customer demand for satisfactory product developed in limited time is rapidly posing a major challenge to product design, and more distributed products are developed to address these concerns. In the distributed ...
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